Reliability challenges in 3D IC packaging technology
Top Cited Papers
- 23 October 2010
- journal article
- Published by Elsevier BV in Microelectronics Reliability
- Vol. 51 (3), 517-523
- https://doi.org/10.1016/j.microrel.2010.09.031
Abstract
No abstract availableKeywords
This publication has 14 references indexed in Scilit:
- Electromigration and Thermomigration in Pb-Free Flip-Chip Solder JointsAnnual Review of Materials Research, 2010
- High precision thermal stress study on flip chips by synchrotron polychromatic x-ray microdiffractionJournal of Applied Physics, 2010
- Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuitsMicroelectronic Engineering, 2010
- Bonding and electromigration of 30µm fine pitch micro-bump interconnectionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2009
- In situ measurement of electromigration-induced transient stress in Pb-free Sn–Cu solder joints by synchrotron radiation based x-ray polychromatic microdiffractionJournal of Applied Physics, 2009
- Recent research advances in Pb-free soldersMicroelectronics Reliability, 2009
- Effect of current crowding on whisker growth at the anode in flip chip solder jointsApplied Physics Letters, 2007
- 3D Chip Stacking Technology with Low-Volume Lead-Free InterconnectionsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2007
- Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwinsApplied Physics Letters, 2007
- Microcontacts with sub-30μm pitch for 3D chip-on-chip integrationMicroelectronic Engineering, 2006