Die-attaching silver paste based on a novel solvent for high-power semiconductor devices
- 21 December 2015
- journal article
- research article
- Published by Springer Science and Business Media LLC in Journal of Materials Science
- Vol. 51 (7), 3422-3430
- https://doi.org/10.1007/s10853-015-9659-8
Abstract
No abstract availableKeywords
Funding Information
- COI Stream Project
- Grant-in-Aid for Scientific Research (Kaken S, 24226017)
- China Scholarship Council
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