Passive-intermodulation analysis between rough rectangular waveguide flanges

Abstract

A new model is presented for the calculation of passive intermodulation (PIM) in waveguide connections. The model considers the roughness of interconnecting waveguide surfaces and the presence of an insulator layer (oxide and contaminants) on these metal surfaces. This results in the generation of a contact resistance, which can excite the PIM level. In particular, the case in which metal-insulator-metal regions are the PIM source is especially investigated. The intermodulation level response is calculated for different waveguide junction parameters like applied mechanical load, surface finish, or metal properties showing qualitative agreement with the measured data published by previous authors.