Development of reworkable underfills, materials, reliability and processing
- 1 June 1999
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components and Packaging Technologies
- Vol. 22 (2), 163-167
- https://doi.org/10.1109/6144.774724
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
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- Cleavable epoxy resins: Design for disassembly of a thermosetJournal of Polymer Science Part A: Polymer Chemistry, 1996
- Reversible crosslinking in epoxy resins. II. New approachesJournal of Applied Polymer Science, 1990