In situ observations on creep fatigue fracture behavior of Sn–4Ag/Cu solder joints
- 30 September 2011
- journal article
- Published by Elsevier BV in Acta Materialia
- Vol. 59 (15), 6017-6028
- https://doi.org/10.1016/j.actamat.2011.06.010
Abstract
No abstract availableKeywords
Funding Information
- National Natural Science Foundation of China (50625103)
- National Key Research and Development Program of China (2010CB631006)
This publication has 32 references indexed in Scilit:
- Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applicationsMaterials Science and Engineering: R: Reports, 2006
- A quantitative evaluation of time-independent and time-dependent deformations of lead-free and lead-containing solder alloysJournal of Electronic Materials, 2006
- Creep deformation characteristics of tin and tin-based electronic solder alloysMetallurgical and Materials Transactions A, 2005
- Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scalesActa Materialia, 2004
- Creep behavior of eutectic Sn–Ag lead-free solder alloyJournal of Materials Research, 2002
- Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part II: Mechanistic Insights and Cyclic Durability Predictions From Monotonic DataJournal of Electronic Packaging, 2002
- Creep of tin, Sb-solution-strengthened tin, and SbSn-precipitate-strengthened tinMetallurgical and Materials Transactions A, 2002
- Lead-free Solders in MicroelectronicsMaterials Science and Engineering: R: Reports, 2000
- Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic soldersJournal of Electronic Materials, 1997
- Rate of consumption of Cu in soldering accompanied by ripeningApplied Physics Letters, 1995