High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study
- 30 May 2018
- journal article
- research article
- Published by American Chemical Society (ACS) in The Journal of Physical Chemistry C
- Vol. 122 (24), 13140-13147
- https://doi.org/10.1021/acs.jpcc.8b02001
Abstract
No abstract availableKeywords
Funding Information
- Ministry of Education of the People's Republic of China (2016YXZD006)
- Natural Science Foundation of Hubei Province (2017CFA046)
- National Natural Science Foundation of China (51676121, 51576076, 51711540031)
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