Mechanical and Thermal Properties of Polymer Composites for Electronic Packaging Application
- 4 June 2008
- journal article
- research article
- Published by SAGE Publications in Journal of Reinforced Plastics and Composites
- Vol. 27 (15), 1573-1584
- https://doi.org/10.1177/0731684407086328
Abstract
Alumina (AE) and mica (ME) particles were used as fillers in epoxy-based polymer composites. Comparisons were made between the composites with respect to mechanical, thermal, and morphological properties. Mechanical and thermal studies were performed on the composites at various filler contents. Dispersion of the filler was evaluated using scanning electron micrograph (SEM). It was found that the flexural modulus of the composites was almost identical as far as AE and ME are concerned, particularly at 025 vol% of filler content. However, obvious increment was observed in the case of AE for flexural strength.Keywords
This publication has 8 references indexed in Scilit:
- Thermo-viscoelastic properties of silica particulate-reinforced epoxy composites: Considered in terms of the particle packing modelActa Materialia, 2006
- Effect of Various Coupling Agents on Properties of Alumina-filled PP CompositesJournal of Reinforced Plastics and Composites, 2006
- Mica reinforced nylon‐6: Effect of coupling agents on mechanical, thermal, and dielectric propertiesJournal of Applied Polymer Science, 2006
- Elastic and elastic–plastic singular fields around a crack-tip in particulate-reinforced composites with progressive debonding damageInternational Journal of Solids and Structures, 2005
- Influence of interphase and moisture on the dielectric spectroscopy of epoxy/silica compositesPolymer, 2005
- Thermal characterization of an epoxy-based underfill material for flip chip packagingThermochimica Acta, 2000
- A TGA technique for determining graphite fiber content in epoxy compositesThermochimica Acta, 1996
- Crack propagation behaviour during three-point bending of polymer matrix composite/Al2O3/polymer matrix composite laminated compositesMaterials Science and Engineering: A, 1995