Millimeter-wave performance of chip interconnections using wire bonding and flip chip
- 1 January 1996
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
The performances of two different interconnection techniques for coplanar MMICs, wire bonding and flip chip, are investigated at millimeter-wave frequencies. By developing an accurate model for the interconnections, which is validated with experimental data up to 120 GHz, the limitations with respect to frequency and interconnection distance of either technique are pointed out, yielding useful data for the design of hybrid MMW-subsystemsKeywords
This publication has 6 references indexed in Scilit:
- Rigorous field theory analysis of flip-chip interconnections in MMICs using the FDTLM methodPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Quasi static analysis of microstrip bondwire interconnectsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Coplanar bond wire interconnections for millimeter-wave applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 51 GHz frontend with flip chip and wire bond interconnections from GaAs MMICs to a planar patch antennaPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1995
- Characteristic Impedance of Integrated Circuit Bond Wires (Short Paper)IEEE Transactions on Microwave Theory and Techniques, 1986