On the rate-controlling step of copper diffusion/oxidation through gold
- 1 November 1979
- journal article
- letter
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 50 (11), 7243-7244
- https://doi.org/10.1063/1.325840
Abstract
We consider both diffusion of copper through gold via grain boundaries and oxidation, and the factors which cause one or the other to be rate limiting. From published data we conclude that when the surface reaction is oxidation in clean air, after a few hundred seconds the rate‐limiting step is oxidation.Keywords
This publication has 3 references indexed in Scilit:
- Oxidation of copper in controlled clean air and standard laboratory air at 50°C to 150°CApplications of Surface Science, 1979
- Low-temperature diffusion of copper through goldJournal of Applied Physics, 1976
- Mass diffusion in polycrystalline copper/electroplated gold planar couplesMetallurgical Transactions, 1972