Heat Transfer Enhancement in Electronic Modules Using Various Secondary Air Injection Hole Arrangements

Abstract

This paper reports an experimental investigation to study the effects of using various designs of secondary air injection hole arrangements on the heat transfer coefficient and the pressure drop characteristics of an array of rectangular modules at different values of free-stream Reynolds numbers in the range 8 × 103 to 2 × 104. The arrangement used is either one staggered row of simple holes or one row of compound injection holes. The pitch distances between the injection holes, as well as the injection angles, were varied in both the streamwise and spanwise directions. Generally, the presence of secondary air through the injection hole arrangement can give up to 54 percent heat transfer enhancement just downstream of the injection holes. The amount of heat transfer enhancement and pressure drop across the electronic modules is very much dependent on the design of the injection holes. The simple angle injection hole arrangement tends to give a better heat transfer enhancement and less pressure drop than the compound angle holes.