Why abrasive free Cu slurry is promising?
- 1 January 2001
- journal article
- Published by Springer Science and Business Media LLC in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
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- Complete-abrasive-free process for copper damascene interconnectionPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A 7 level metallization with Cu damascene process using newly developed abrasive free polishingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Solution chemical constraints in the chemical-mechanical polishing of copper: Aqueous stability diagrams for the Cu-H2O and Cu-NH3-H2O systemsJournal of Electronic Materials, 1996