The effect of heat treatment on the elastic and dissipative properties of copper with the submicrocrystalline structure
- 30 April 1993
- journal article
- Published by Elsevier BV in Acta Metallurgica et Materialia
- Vol. 41 (4), 1041-1046
- https://doi.org/10.1016/0956-7151(93)90153-j
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- On the so-called “recrystallizative” internal friction peak in polycrystalline copperScripta Metallurgica et Materialia, 1992
- Plastic deformation of alloys with submicron-grained structureMaterials Science and Engineering: A, 1991
- Formation of submicrometre-grained structure in magnesium alloy due to high plastic strainsJournal of Materials Science Letters, 1990
- Mechanism of the effect of the normal-superconducting transition on the amplitude-dependent damping and modulus defect in leadJournal of Low Temperature Physics, 1982
- High-temperature relaxation peaks in dispersion-hardened S.A.P. alloysphysica status solidi (a), 1976
- Dislocation mobility in zinc at low temperaturesphysica status solidi (a), 1971
- Theory of Mechanical Damping Due to DislocationsJournal of Applied Physics, 1956
- Berechnung der Fließgrenze von Mischkristallen auf Grund der Plastizitätsbedingung für Einkristalle .ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 1929