Grinding of silicon wafers: A review from historical perspectives
- 5 June 2008
- journal article
- review article
- Published by Elsevier BV in International Journal of Machine Tools and Manufacture
- Vol. 48 (12-13), 1297-1307
- https://doi.org/10.1016/j.ijmachtools.2008.05.009
Abstract
No abstract availableThis publication has 28 references indexed in Scilit:
- ELID grinding of silicon wafers: A literature reviewInternational Journal of Machine Tools and Manufacture, 2007
- Grinding wheels for manufacturing of silicon wafers: A literature reviewInternational Journal of Machine Tools and Manufacture, 2007
- Simultaneous double side grinding of silicon wafers: a literature reviewInternational Journal of Machine Tools and Manufacture, 2006
- Theoretical analysis on the effects of crystal anisotropy on wiresawing process and application to wafer slicingInternational Journal of Machine Tools and Manufacture, 2006
- A grinding-based manufacturing method for silicon wafers: an experimental investigationInternational Journal of Machine Tools and Manufacture, 2005
- Finite element analysis for grinding of wire-sawn silicon wafers: a designed experimentInternational Journal of Machine Tools and Manufacture, 2003
- A study on surface grinding of 300 mm silicon wafersInternational Journal of Machine Tools and Manufacture, 2001
- Fine grinding of silicon wafers: designed experimentsInternational Journal of Machine Tools and Manufacture, 2001
- Fine grinding of silicon wafersInternational Journal of Machine Tools and Manufacture, 2001
- Grinding induced subsurface cracks in silicon wafersInternational Journal of Machine Tools and Manufacture, 1999