Research of LTCC/Cu, Ag multilayer substrate in microelectronic packaging
- 1 June 2002
- journal article
- Published by Elsevier BV in Materials Science and Engineering B
- Vol. 94 (1), 48-53
- https://doi.org/10.1016/s0921-5107(02)00073-9
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Camber development during cofiring Ag-based low-dielectric-constant ceramic packageJournal of Materials Research, 1997
- Microstructural Evolution of Copper Thick Films Observed by Environmental Scanning Electron MicroscopyJournal of the American Ceramic Society, 1996
- Cosintering process for glass-ceramic/copper multilayer ceramic substrateIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1991