The use of mica flakes for reducing internal stress in cured epoxy resin
- 4 April 1994
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 52 (1), 107-118
- https://doi.org/10.1002/app.1994.070520113
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- Molecular packing and free volume in crosslinked epoxy networksPolymer, 1991
- Effect of mica on the curing behavior of an amine‐cured epoxy system: Differential scanning calorimetric studiesJournal of Applied Polymer Science, 1990
- Effects of residual stresses on the failure micromechanisms in toughened epoxy systemsJournal of Materials Science, 1990
- Epoxy Molding Compounds as Encapsulation Materials for Microelectronic DevicesPublished by Springer Science and Business Media LLC ,1989
- Superior properties of aminimide-cured epoxy resin as a matrix for mica-reinforced plasticsJournal of Materials Science Letters, 1987
- Internal stress of epoxy resin modified with acrylic core‐shell particles prepared by seeded emulsion polymerizationJournal of Applied Polymer Science, 1986
- Correlation between resin material variables and transverse cracking in compositesJournal of Materials Science, 1984
- The influence of filler particles and polymer structure on the mobility of polymer moleculesJournal of Applied Polymer Science, 1981
- Molding and torsional testing of tubular specimens of glass fiber‐reinforced polypropylenePolymer Composites, 1981
- Effect of induced thermal stresses on the coefficients of thermal expansion and densities of filled polymersJournal of Polymer Science Part A-2: Polymer Physics, 1969