Ultrasonic vibration assisted electro-discharge machining of microholes in Nitinol
- 20 June 2003
- journal article
- Published by IOP Publishing in Journal of Micromechanics and Microengineering
- Vol. 13 (5), 693-700
- https://doi.org/10.1088/0960-1317/13/5/322
Abstract
An ultrasonic vibration has been superposed on the normal electrode movement to increase the flushing effect during a micro electro-discharge machining (EDM) process. A systematic study on the effects of ultrasonic vibration on the EDM performance for fabricating microholes in Nitinol has been completed. The introduction of ultrasonic vibration to the micro-EDM process has increased the machining efficiency more than 60 times, without significantly increasing the electrode wear. Numerical simulation reveals that the efficiency improvement is attributed to the strong stirring effect caused by ultrasonic vibration, which results in an excellent flushing in the micro-EDM process.Keywords
This publication has 9 references indexed in Scilit:
- Fabrication of symmetrical section microfeatures using the electro-discharge machining block electrode methodJournal of Micromechanics and Microengineering, 2002
- Residual stress-loaded titanium$ndash$nickel shape-memory alloy thin-film micro-actuatorsJournal of Micromechanics and Microengineering, 2002
- The electro-discharge machining characteristics of TiNi shape memory alloysJournal of Materials Science, 2001
- A study on the machining characteristics of TiNi shape memory alloysJournal of the American Academy of Dermatology, 2000
- Effects of ultrasonic vibrations in micro electro-discharge machining of microholesJournal of Micromechanics and Microengineering, 1999
- Ultrasonic vibration pulse electro-discharge machining of holes in engineering ceramicsJournal of the American Academy of Dermatology, 1995
- A Study of the Effect of Synchronizing Ultrasonic Vibrations with Pulses in EDMCIRP Annals, 1991
- Effects of Ultrasonic Vibrations on the Performances in EDMCIRP Annals, 1989
- Drilling of Deep Microholes by EDMCIRP Annals, 1989