Improved power conversion efficiency in high-performance photodiodes by flip-chip bonding on diamond
- 17 December 2014
- journal article
- Published by Optica Publishing Group in Optica
- Vol. 1 (6)
- https://doi.org/10.1364/optica.1.000429
Abstract
No abstract availableKeywords
Funding Information
- Defense Advanced Research Projects Agency (DARPA) (PULSE program)
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