Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation
- 1 April 2003
- journal article
- Published by Elsevier BV in Thin Solid Films
- Vol. 429 (1-2), 201-210
- https://doi.org/10.1016/s0040-6090(03)00406-1
Abstract
No abstract availableThis publication has 32 references indexed in Scilit:
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