Metal CVD for microelectronic applications: An examination of surface chemistry and kinetics

Abstract

We review the surface chemistry and kinetics relevant to the chemical vapor deposition (CVD) of metals used for microelectronic applications. Our efforts focus on the surface chemistry of aluminum, tungsten, and copper CVD, which have received the most recent interest for metallization. We first briefly review a variety of topics concerning the applications and the chemistry and kinetics of metal CVD. We also give a brief overview of the application of surface science techniques to the study of CVD-related surface chemistry.