Development of conductive adhesive joining for surface-mounting electronics manufacturing
- 1 May 1995
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 18 (2), 313-319
- https://doi.org/10.1109/96.386267
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Reliability and failure mechanism of isotropically conductive adhesives jointsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reliability of Surface‐mounted Anisotropically Conductive Adhesive JointsCircuit World, 1993
- The Oxide HandbookPublished by Springer Science and Business Media LLC ,1982