Nanoporous Structures Prepared by an Electrochemical Deposition Process
Top Cited Papers
- 2 October 2003
- journal article
- research article
- Published by Wiley in Advanced Materials
- Vol. 15 (19), 1610-1614
- https://doi.org/10.1002/adma.200305160
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- Electrochemically Deposited Tin-Silver-Copper Ternary Solder AlloysJournal of the Electrochemical Society, 2002
- Tin whiskers studied by focused ion beam imaging and transmission electron microscopyJournal of Applied Physics, 2002
- Minimization of tin whisker formation for lead‐free electronics finishingCircuit World, 2001
- Nanostructured Copper Filaments in Electrochemical DepositionPhysical Review Letters, 2001
- Nanocrystalline Nickel NanoparticlesAdvanced Materials, 2000
- Kinetics of the electrodeposition of PbSn alloys: Part I. At glassy carbon electrodesJournal of Electroanalytical Chemistry, 2000
- In situ probing of interfacial processes in the electrodeposition of copper by confocal Raman microspectroscopyJournal of Electroanalytical Chemistry, 1998
- Further insights on dynamic morphological transitions in quasi-two-dimensional electrodepositionPhysical Review E, 1997
- The formation of patterns in non-equilibrium growthNature, 1990
- Diffusion-Limited Aggregation, a Kinetic Critical PhenomenonPhysical Review Letters, 1981