Development of a Pad Conditioning Method for ILD CMP using a High Pressure Micro Jet System
Open Access
- 28 February 2007
- journal article
- Published by The Korean Institute of Electrical and Electronic Material Engineers in Transactions on Electrical and Electronic Materials
- Vol. 8 (1), 26-31
- https://doi.org/10.4313/teem.2007.8.1.026
Abstract
No abstract availableThis publication has 7 references indexed in Scilit:
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- Development and Analysis of a High-Pressure Micro Jet Pad Conditioning System for Interlayer Dielectric Chemical Mechanical PlanarizationJapanese Journal of Applied Physics, 2005
- Effect of Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMPJournal of the Electrochemical Society, 2005
- A theory of pad conditioning for chemical-mechanical polishingJournal of Engineering Mathematics, 2004
- Fundamental Tribological and Removal Rate Studies of Inter-Layer Dielectric Chemical Mechanical PlanarizationJapanese Journal of Applied Physics, 2003
- Dispersion Number Studies in CMP of Interlayer Dielectric FilmsJournal of the Electrochemical Society, 2003
- Pad conditioning in chemical mechanical polishingJournal of the American Academy of Dermatology, 2002