Efficient thermal placement of standard cells in 3D ICs using a force directed approach
- 13 May 2004
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal placement method presented in this paper uses an iterative force-directed approach in which thermal forces direct cells away from areas of high temperature. Finite element analysis (FEA) is used to calculate temperatures efficiently during each iteration. Benchmark circuits produce thermal placements with both lower temperatures and thermal gradients while wirelength is minimally affected.Keywords
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