Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: II. Particleboard production and properties
- 31 December 2002
- journal article
- Published by Elsevier BV in International Journal of Adhesion and Adhesives
- Vol. 22 (6), 481-486
- https://doi.org/10.1016/s0143-7496(02)00059-3
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Lignin and ligninsulfonate in non-conventional bonding—an overviewEuropean Journal of Wood and Wood Products, 1991
- Kraft lignin utilization in adhesivesWood Science and Technology, 1988