Physical properties of medium-density wheat straw particleboard using different adhesives
- 11 April 2003
- journal article
- Published by Elsevier BV in Industrial Crops and Products
- Vol. 18 (1), 47-53
- https://doi.org/10.1016/s0926-6690(03)00032-3
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Compression and tensile strength of low-density straw-protein particleboardIndustrial Crops and Products, 2001
- Adhesion properties of soy protein with fiber cardboardJournal of Oil & Fat Industries, 2001
- Upgrading of urea formaldehyde-bonded reed and wheat straw particleboards using silane coupling agentsJournal of Wood Science, 1998
- Mechanical and thermal properties of particle boards made from farm residuesBioresource Technology, 1992