Reliability of Pressure-Sensitive Adhesive Tapes for Heat Sink Attachment in Air-Cooled Electronic Assemblies
- 1 December 2004
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Device and Materials Reliability
- Vol. 4 (4), 650-657
- https://doi.org/10.1109/tdmr.2004.838394
Abstract
This study investigates the reliability of commercially available pressure-sensitive adhesive (PSA) tapes used for electronic component-to-heat sink attachment. It is found that creep can affect the PSA reliability. Therefore, creep is experimentally characterized using isothermal, constant load, double lap shear measurements in conditions representative of vertically oriented heat sink applications. PSA joint life predictions are derived from the accelerated creep characteristics using a secondary creep model. The creep resistance of a laminated silicone/aluminum/acrylic PSA tape is found to be significantly lower than that of a single-layer acrylic tape. This suggests that the potential impact of tape creep on joint reliability should be carefully evaluated as a function of tape chemistry/construction and application environment. Furthermore, the sensitivity of PSA creep characteristics to both operating temperature and heat sink weight highlights the need for thermally optimized, least-weight heat sink designs.Keywords
This publication has 21 references indexed in Scilit:
- Effects of assembly process variables on voiding at a thermal interfacePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2004
- Environmental aging and deadhesion of siloxane-polyimide-epoxy adhesiveIEEE Transactions on Components and Packaging Technologies, 2003
- Prediction of effect of heat sink adhesive on mechanical reliability of a wire bonded plastic ball grid array packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Mechanical stress reduction in heat sink bond layers-a numerical feasibility studyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Lewis Acid/Lewis Base Effects in Corrosion and Polymer Adhesion at Aluminum SurfacesJournal of the Electrochemical Society, 2003
- Interfacial Versus Cohesive Failure on Polymer-Metal Interfaces in Electronic Packaging—Effects of Interface RoughnessJournal of Electronic Packaging, 2002
- Viscoelastic behaviour and time–temperature correspondence of HDPE with varying levels of process-induced orientationPolymer, 2001
- Creep rupture of a GFRP composite at elevated temperaturesComputers & Structures, 2000
- Failure-mechanism models for creep and creep ruptureIEEE Transactions on Reliability, 1993
- The Temperature Dependence of Relaxation Mechanisms in Amorphous Polymers and Other Glass-forming LiquidsJournal of the American Chemical Society, 1955