Effects of oxidation and particle shape on critical volume fractions of silver-coated copper powders in conductive adhesives for microelectronic applications
- 29 October 2004
- journal article
- research article
- Published by Wiley in Polymer Engineering & Science
- Vol. 44 (11), 2075-2082
- https://doi.org/10.1002/pen.20212
Abstract
No abstract availableKeywords
This publication has 28 references indexed in Scilit:
- Electrical properties of composites as affected by the degree of mixedness of the conductive filler in the polymer matrixPolymer Engineering & Science, 2002
- Influence of carbon fiber surface treatments on the structure and properties of conductive carbon fiber/polyethylene filmsJournal of Applied Polymer Science, 2002
- Evaluation of electrical conductivity models for conductive polymer compositesJournal of Applied Polymer Science, 2001
- On oxidation and adhesion of copper‐filled PEJournal of Applied Polymer Science, 2001
- Carbon-black-filled polyolefine as a positive temperature coefficient material: Effect of composition, processing, and filler treatmentJournal of Applied Polymer Science, 1998
- Critical Volume Fractions in Conductive CompositesJournal of Composite Materials, 1992
- The conduction mechanism of polymer–filler particlesJournal of Applied Polymer Science, 1985
- The effect of compounding on the conductive properties of EMI shielding compoundsAdvances in Polymer Technology, 1984
- Electrical resistivity of hot-pressed silver-polystyrene powder mixtureJournal of Materials Science, 1977
- Percolation and ConductionReviews of Modern Physics, 1973