A high performance Balanced Power Amplifier and Its Integration into a Front-end Module at PCS Band
- 1 June 2007
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE) in 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium
- p. 251-254
- https://doi.org/10.1109/rfic.2007.380876
Abstract
A novel load insensitive power amplifier (LIPA) with balanced structure is developed for 3G (HSDPA and HSUPA) handset application at PCS band from 1850-1910 MHz. No external regulated voltage and analog voltage supplies are required at high power level and it is compatible with DC-to-DC converters. Digital or analog control may be applied to further improve its PAE at low and middle power levels. This newly featured PA is integrated into a 4x7 mm2 front-end module (FEM) with good performance, especially under load mismatch condition.Keywords
This publication has 3 references indexed in Scilit:
- A 2.4-V Low-Reference-Voltage Operation, InGaP HBT-MMIC Power Amplifier Module for CDMA ApplicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2006
- WCDMA PCS Handset Front End ModulePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2006
- Technology developments driving an evolution of cellular phone power amplifiers to integrated RF front-end modulesIEEE Journal of Solid-State Circuits, 2001