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Curing mechanism and thermal properties of epoxy-imidazole systems
Home
Publications
Curing mechanism and thermal properties of epoxy-imidazole systems
Curing mechanism and thermal properties of epoxy-imidazole systems
MH
M. S. Heise
M. S. Heise
GM
G. C. Martin
G. C. Martin
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1 January 1989
journal article
Published by
American Chemical Society (ACS)
in
Macromolecules
Vol. 22
(1)
,
99-104
https://doi.org/10.1021/ma00191a020
Abstract
No abstract available
Cited by 162 articles