Insulating Properties of Package for Ultrahigh-Voltage, High-Temperature Devices

Abstract

Insulating properties of package for ultrahigh-voltage, high-temperature devices have been investigated. While all the packages have enough insulating strength at room temperature, deterioration of the insulating property at high temperature has been found with some packages. The authors have found that this deterioration is attributed to degrade the insulation property of AlN ceramics for DBC substrate at high temperature and that there is a various degree in the deterioration.