Materials characterization, conduction development, and curing effects on reliability of isotropically conductive adhesives
- 1 March 1998
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- Vol. 21 (1), 23-31
- https://doi.org/10.1109/95.679028
Abstract
No abstract availableKeywords
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