Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique
- 1 April 2007
- journal article
- Published by Elsevier BV in Thermochimica Acta
- Vol. 455 (1-2), 148-155
- https://doi.org/10.1016/j.tca.2006.11.034
Abstract
No abstract availableKeywords
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