Process and Packaging Innovations for Moore’s Law Continuation and Beyond
- 1 December 2019
- conference paper
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 1.1.1-1.1.6
- https://doi.org/10.1109/iedm19573.2019.8993462
Abstract
This presentation describes various revolutionary process and packaging technologies on the horizon that will (i) extend Moore’s Law scaling through and beyond the next decade and (ii) enable many new, exciting integrated circuit opportunities and functions for future products. By using these new and exciting technologies holistically, and coupled with technology and design co-optimization, the future of Moore’s Law is brighter than ever.Keywords
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