Evolution of surface morphology in TiNiCu shape memory thin films
- 23 October 2006
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 89 (17), 171922
- https://doi.org/10.1063/1.2361275
Abstract
A transition of film surface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin film shape memory alloy. The mechanisms for this transition are discussed based on film stress evolution. During annealing surface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress.Keywords
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