Effect of electrode pattern on the outputs of piezosensors for wire bonding process control
- 29 January 2003
- journal article
- Published by Elsevier BV in Materials Science and Engineering B
- Vol. 99 (1-3), 121-126
- https://doi.org/10.1016/s0921-5107(02)00508-1
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Sensors for automatic process control of wire bondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Ultrasonic wire-bond quality monitoring using piezoelectric sensorSensors and Actuators A: Physical, 1998
- Real Time Non-Destructive Evaluation in Ultrasonic Wire BondingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1983