Effect of nitric acid on wet etching behavior of Cu/Mo for TFT application
- 1 January 2011
- journal article
- Published by Elsevier BV in Current Applied Physics
- Vol. 11 (1), S262-S265
- https://doi.org/10.1016/j.cap.2010.11.095
Abstract
No abstract availableThis publication has 3 references indexed in Scilit:
- Electrochemical Equilibria of Copper in Aqueous Phosphoric Acid SolutionsJournal of the Electrochemical Society, 2009
- 22.3: A Novel Barrierless Cu Gate for TFT-LCDSID Symposium Digest of Technical Papers, 2006
- Copper metallization for ULSL and beyondCritical Reviews in Solid State and Materials Sciences, 1995