Low-pressure thermal bonding
- 31 August 2011
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 88 (8), 2427-2430
- https://doi.org/10.1016/j.mee.2011.01.022
Abstract
No abstract availableKeywords
Funding Information
- National High Technology Research and Development Program of China (2008AA04Z303)
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