Bridging the Processor-Memory Performance Gapwith 3D IC Technology
- 1 June 2005
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Design & Test of Computers
- Vol. 22 (6), 556-564
- https://doi.org/10.1109/mdt.2005.134
Abstract
No abstract availableKeywords
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