Growth of intermetallic layer in multi-laminated Ti/Al diffusion couples
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- 5 November 2006
- journal article
- Published by Elsevier BV in Materials Science and Engineering: A
- Vol. 435-436, 638-647
- https://doi.org/10.1016/j.msea.2006.07.077
Abstract
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This publication has 31 references indexed in Scilit:
- Using cold roll bonding and annealing to process Ti/Al multi-layered composites from elemental foilsMaterials Science and Engineering: A, 2004
- Resistance-curve and fracture behavior of Ti–Al3Ti metallic–intermetallic laminate (MIL) compositesActa Materialia, 2003
- The effect of processing variables on the structure and chemistry of Ti-aluminide based LMCSMaterials Science and Engineering: A, 2002
- Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripeningPhysical Review B, 1996
- Determination of the kinetics of TiAl3 formation from fine Ti and Al particles using differential scanning calorimetryMaterials Science and Engineering: A, 1994
- Formation of TiAl3 layer on titanium alloysMaterials Science and Engineering: A, 1991
- Use of the effective heat of formation rule for predicting phase formation sequence in AlNi systemsMaterials Letters, 1990
- Solute effect of Cu on interdiffusion inTi compound filmsPhysical Review B, 1985
- Kinetics of the interaction of Ti(s) with Al(1)Journal of the Less Common Metals, 1968
- The nature and growth of interaction layers formed during the reaction between solid titanium and liquid aluminiumJournal of the Less Common Metals, 1959