On the Asymmetric Growth Behavior of Intermetallic Compound Layers During Extended Reflow of Sn-Rich Alloy on Cu
- 31 July 2012
- journal article
- research article
- Published by Springer Science and Business Media LLC in Metallurgical and Materials Transactions
- Vol. 43 (10), 3442-3446
- https://doi.org/10.1007/s11661-012-1329-8
Abstract
No abstract availableKeywords
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