Geometric modelling of IC die bonds for inspection
- 31 July 1989
- journal article
- Published by Elsevier BV in Pattern Recognition Letters
- Vol. 10 (1), 47-52
- https://doi.org/10.1016/0167-8655(89)90017-2
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Fitting conic sections to “very scattered” data: An iterative refinement of the bookstein algorithmComputer Graphics and Image Processing, 1982
- SIGHT-I: A Computer Vision System for Automated IC Chip ManufactureIEEE Transactions on Systems, Man, and Cybernetics, 1978
- A Transistor Wire-Bonding System Utilizing Multiple Local Pattern Matching TechniquesIEEE Transactions on Systems, Man, and Cybernetics, 1976
- A problem in computer vision: Orienting silicon integrated circuit chips for lead bondingComputer Graphics and Image Processing, 1975