The plastic deformation of silicon between 300°C and 600°C
- 1 December 1981
- journal article
- other
- Published by Taylor & Francis Ltd in Philosophical Magazine A
- Vol. 44 (6), 1407-1413
- https://doi.org/10.1080/01418618108235821
Abstract
Constant strain-rate compression of silicon single crystals has been performed under a hydrostatic pressure of 1500 MPa. The crystals were deformed at temperatures as low as 300°C and had resolved flow stress values of up to 1000 MPa. The variation of yield strength with temperature suggests a transition of the mechanism controlling the deformation near 600°C.Keywords
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