Ultrahigh-Speed InP/InGaAs Double-Heterostructure Bipolar Transistors and Analyses of Their Operation

Abstract

Novel hexagonal emitters are proposed for heterostructure bipolar transistors (HBTs) with a base-metal-overlaid emitter-base self-alignment structure to reduce parasitic effects. Two different layer structures for InP/InGaAs double-heterostructure bipolar transistors (DHBTs) that can more fully utilize the inherent potential of the materials are used to enhance unity current gain cutoff frequency, f _T, and maximum oscillation frequency, f _max . On a wafer with a 180-nm-thick collector, a transistor with a 20-µ m² hexagonal emitter electrode shows an f _T of 230 GHz and an f _max of 147 GHz, while with a 4-µ m² hexagonal emitter electrode the corresponding values are 225 GHz and 241 GHz. f _max of 300 GHz is achieved for a transistor with a 4-µ m² emitter electrode and a 330-nm-thick collector. Transistor operation is analyzed using a simple but appropriate small-signal equivalent circuit model of a transistor that includes internal and external base/collector capacitances and yields good estimates of the measured scattering (s-) parameters. Even in these InP-based (D)HBTs, the internal collector capacitance increases with collector current density due to the Kirk effect which degrades performance. In thin-collector (D)HBTs, the increase in the internal collector capacitance is suppressed, which increases the collector current density at which the transistor can operate normally, and f _T is increased by both transit time reduction and high-collector-current operation.