Electrochemical examination of surface films formed during chemical mechanical planarization of copper in acetic acid and dodecyl sulfate solutions
- 30 June 2009
- journal article
- research article
- Published by Elsevier BV in Thin Solid Films
- Vol. 517 (16), 4587-4592
- https://doi.org/10.1016/j.tsf.2009.03.063
Abstract
No abstract availableKeywords
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