On the deposition rate in a high power pulsed magnetron sputtering discharge

Abstract

The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density $I_{T_{\mathrm{pd}}}$ of up to $570\mathrm{mA}{\mathrm{cm}}^{-2}$ , HPPMS and dcMS deposition rates are equal. For $I_{T_{pd}}>570\mathrm{mA}{\mathrm{cm}}^{-2}$ , optical emission spectroscopy shows a pronounced increase of the ${\mathrm{Cr}}^{+}∕{\mathrm{Cr}}^0$ signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed.