A micron-thickness, planar Schottky diode chip for terahertz applications with theoretical minimum parasitic capacitance

Abstract
The design and fabrication of a novel planar Schottky diode with greatly reduced shunt capacitance for millimeter- and submillimeter-wave applications is described. The dominant pad-to-pad shunt capacitance is minimized by replacing the substrate GaAs with a low-dielectric substitute. This replacement substrate can be easily removed by the user after the device is soldered into the mixer circuit. This will yield the minimum possible pad-to-pad shunt capacitance.

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