Synthesis and characterization of silver–copper colloidal ink and its performance against electrical migration
- 31 December 2010
- journal article
- Published by Elsevier BV in Materials Research Bulletin
- Vol. 45 (12), 1837-1843
- https://doi.org/10.1016/j.materresbull.2010.09.013
Abstract
No abstract availableKeywords
This publication has 27 references indexed in Scilit:
- Synthesis of nearly monodisperse palladium (Pd) nanoparticles by using oleylamine and trioctylphosphine mixed ligandsJournal of Organometallic Chemistry, 2009
- A simple and effective route for the synthesis of nano-silver colloidal dispersionsJournal of the Chinese Institute of Chemical Engineers, 2008
- Corrosion characteristics of copper microparticles and copper nanoparticles in distilled waterCorrosion Science, 2006
- Effect of alkaline ion on the mechanism and kinetics of chemical reduction of silverMaterials Chemistry and Physics, 2005
- Study of nano-Au-assembled amperometric CO gas sensorSensors and Actuators B: Chemical, 2005
- Studies on the Evolution of Silver Nanoparticles in Micelle by UV-PhotoactivationJournal of Nanoparticle Research, 2003
- Synthesis of nanosized silver particles by chemical reduction methodMaterials Chemistry and Physics, 2000
- Alloy Formation of Gold−Silver Nanoparticles and the Dependence of the Plasmon Absorption on Their CompositionThe Journal of Physical Chemistry B, 1999
- Synthesis, Characterization, and Properties of Metallic Copper NanoparticlesChemistry of Materials, 1998
- Bimetallic nanoparticles—novel materials for chemical and physical applicationsNew Journal of Chemistry, 1998