Impact of adhesive rheology on stress-distortion of bonded plastic substrates for flexible electronics applications
- 30 September 2011
- journal article
- Published by Elsevier BV in Microelectronic Engineering
- Vol. 88 (9), 2852-2856
- https://doi.org/10.1016/j.mee.2011.02.099
Abstract
No abstract availableKeywords
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