High‐Density Stretchable Electronics: Toward an Integrated Multilayer Composite
- 17 August 2010
- journal article
- research article
- Published by Wiley in Advanced Materials
- Vol. 22 (36), 4030-4033
- https://doi.org/10.1002/adma.201000515
Abstract
High‐density stretchable electronics are achieved using multilayer interconnects on an elastomeric substrate. Two major challenges associated with stretchable electronics—increasing integration density and improving electrical bonding—have been addressed by our innovative multilayer via‐bonding technology. The resulting multichip‐module architecture provides an elastic, high‐density solution for numerous potential applications.Keywords
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