Influence of Interfacial Structure Development on the Fracture Mechanism and Bond Strength of Aluminum/Copper Bimetal Plate
- 1 January 2006
- journal article
- Published by Japan Institute of Metals in MATERIALS TRANSACTIONS
- Vol. 47 (4), 1232-1239
- https://doi.org/10.2320/matertrans.47.1232
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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